Galvanotest2000 3000電解膜厚儀設備技術規格書設備技術規格書
Equipment Technical Specification
設備名稱:Galvanotest2000 3000電解膜厚儀設備技術規格書 庫侖測厚儀
Equipment name: Plating thickness tester
型號/Model:Galvanotest 3000
廠家及產地/ Manufacturer and Production Place:德國EPK/ ElektroPhysik
Galvanotest2000 3000電解膜厚儀設備技術規格書主要技術參數/Main technical requirements:
1. 測量范圍/Measure range: 0.05μm到75μm
2. 準確測量電鍍件(銅、鎳、鉻等)各層厚度/Accurately measure the plating thickness(Cu/Ni/Cr);
3. 測量面積/Measuring area: B: 4mm2 (直徑2.26mm) C: 1mm2 (直徑1.13mm) D: 0.25mm2 (直徑0.56mm) K: 電解杯(為測量小部件和導線用)
4. 測量不確定性 /Measuring uncertainty:
4mm2測量面積:± (%讀值)
1mm2測量面積:± (%讀值)
0.25mm2測量面積:± (%讀值)
如果沒有標準板,可認為UST為10%。
*UST-鍍層厚度標準板的容差(百分數表示)。大數情況下為±5%。
Rubber gasket / mask | Diameter | Measuring area | Measuring uncertainty* in percent of reading |
Rubber gasket B | 2,26 mm | 4mm2 | 6% |
Mask C | 1,13 mm | 1mm2 | 9% |
Mask D | 0,56 mm | 0.25mm2 | 20% |
* The specifications are based on calibration of GalvanoTest 3000 using ElektroPhysik thickness standards.
5. 其他參數
可測量超過70種涂層/基體組合,請參閱電解液選擇表
Measurable coating/base combinations more than 70, please refer to the electrolyte selection table
溶解速度/De-plating speed:0.3~40mm/min
單位/Measuring unit:英制或公制(inches/μm)
厚度顯示/ Display of readings:4位浮點讀值/4-digits digital display with floating point 。
16位字母數字顯示/ Alphanumerical display 16-digits :
顯示儀器調整值,如金屬,溶解速度等/display of instrument settings and operating steps。
指針表:監視溶解過程Analogue instrument for monitoring the de-plating process 。
數據存儲/ Data memory:
18種不同金屬選擇,可存儲2000個讀值/max. 2,000 readings storable in a maximum of 18 application memories。
操作:按鍵/Operation via key pad
備用接口/Data ports :RS-232
電源Power supply:110V/220V±10% 50/60Hz /10W
重量/Weight:儀器/ instrument: 2.5Kg 測量支架/ precision holder: 2.5Kg
Galvanotest2000 3000電解膜厚儀設備技術規格書備件和消耗材料/Spare parts & expendables
1. 測量電鍍件(銅、鎳、鉻等)相關電解液及電解頭/Relative car plating thickness measure electrolyzing solution and measure head;
2. 標準配置/Standard supply
Galvanotest3000儀帶模擬表、RS232C接口、內置循環泵的測量支架
-GalvanoTest 3000 processing unit
-interface for MiniPrint 4100 data printer or PC
-measuring stand 3000 with integrated circulation pump
I型含內部噴嘴的電解池/outer measuring cell and inner measuring cell, type I
2個密封墊 B型(4mm2) /2 rubber gaskets B (4,00 mm2)
2個用于C、D片的密封墊,直徑1.5mm /2 rubber gaskets (.1,5mm) for sealing the masks
20片測量面封貼片/20 masks C (1,00 mm2)
20片測量面封貼片/20 masks D (0,25 mm2)
橡皮鉛筆/rubber pencil
5 x100 ml可按客戶要求的電解液/5 x100 ml electrolyte solution, a sorted to customer requirements
1個100 ml裝使用過的廢電解液的瓶子/1 bottle for used electrolyte solution, 100 ml
1個100 ml用于清洗電解池的噴霧瓶 /1 washing bottle, 100 ml
吸水紙1包/1 package absorbant paper
操作說明書1份 /operating instructions including works certificate
3. Galvanotest2000 3000電解膜厚儀設備技術規格書 推薦備件/Recommended accessories
使用不同電解液時的I型或II型內部噴嘴/inner measuring cell type I or II, for working with a second electrolyte solution
定位臂/ positioning arm
替換泵管/ spare pump tube
帶連接電纜的電解液杯/ electrolyte cup incl. connecting cable
導線鍍層測量夾/wire holder for measuring wires
小部件夾具/ small parts holder
7瓶100ml電解液的瓶架/ bottle stand for holding up to 7 electrolyte solution bottles, 100 ml each
校準板/coating thickness standards
用于5個內部噴嘴的測量支架/ measuring cell stand for holding up to 5 inner measuring cells
替換密封墊/spare rubber gaskets B (4 mm2)
封貼片/masks C (1 mm2)
封貼片/masks D (0.25 mm2)
定制密封墊/modified rubber gasket D/Au (0,25 mm2)
備用吸管/spare pipette
附加電解液/electrolyte selection
備用橡皮鉛筆/spare rubber pencil
定心器/centering device (Z2)
打印機MINIPRINT 4000/ external accu battery powered data printer MiniPrint 4100
打印機MINIPRINT4000的連接電纜/ connecting cable for MiniPrint 4100 data printer
連接記錄儀的電纜/connecting cable for writer
連接PC或兼容打印機的RS232電纜/ RS 232 connecting cable for PC or printer
MSoft7000數據傳輸程序/MSoft7000 data transfer program
附錄:Galvanotest2000 3000電解膜厚儀設備技術規格書電解液(E)和鍍層厚度標準(ST)選擇/Elektrolyt selection table
Coating 底材 鍍層 Substrate | Ag | Au | Cd | Cr | Cu | Brass | Ni | 化學鎳Current-less Ni | Pb | Pb/Sn | Sn | Sn/Zn | Zn | |
銀 | 金 | 鎘 | 鉻 | 銅 | 黃銅 | 鎳 | 鉛 | 鉛/錫 | 錫 | 錫/鋅 | 鋅 | |
非金屬 Non metal | E4 | | E5 | E11 | E4 | E4 | E14 | E17 | E15 | E4 | E7 | E7 | E6 | * |
| | 1 | 8 | | | | | | | | | | | | | | 8 | | 8 | | | | | | | ** | |
銀 Ag | | | | | | | | | E15 | | | | | |
| | | | | | | | | | | | | | | | | 8 | | | | | | | | | |
鋁 Al | E4 | | E5 | E11 | E4 | E4 | E14 | E17 | E15 | E4 | E11 | | E6 | |
8 | | | | 8 | | 8 | | 8 | | 8 | | 8 | | | 8 | | 8 | | 8 | | 8 | | | | 8 | |
青銅 Bronze | E8 | | | | | | | | | | E7 | | | |
8 | | | | | | | | | | | | | | | | | | | | | 8 | | | | | |
鎘 Cd | | | | | | | | | | | E7 | | | |
| | | | | | | | | | | | | | | | | | | | | 8 | | | | | |
銅 Cu | E8 | | E5 | E7 | | | E14 | | E15 | E4 | E9 | E7 | E6 | |
| ST | 1 | 8 | | ST | | ST | | | | | | | ST | | | | | 8 | | 5 | ST | 8 | | ST | |
鋼鐵 Steel | E4 | | E5 | E11 | E4 | E4 | E14 | E17 | E15 | E4 | E7 | E7 | E20 | |
| ST | 8 | 8 | | ST | | ST | | ST | | | | | ST | | | 8 | | 8 | | | ST | 8 | | ST | |
黃銅 Brass | E8 | | E5 | E7 | E12 | | E14 | | E15 | E4 | E9 | E7 | E6 | |
| ST | 1 | 8 | | ST | | ST | 8 | | | | | | ST | | | 8 | | 8 | | 5 | ST | 8 | 5 | ST | |
鎳 Ni | E8 | | E5 | E11 | E4 | E4 | | | E15 | | E7 | | E6 | |
8 | | 1 | 8 | 8 | | | ST | 8 | | 8 | | | | | | | 8 | | | | 8 | | | | 8 | |
硅 Si | | | | | | | E14 | | | | | | | |
| | | | | | | | | | | | 8 | | | | | | | | | | | | | | |
鋅 Zn | | | | | E12 | | | | | | | | | |
| | | | | | | | 2 | ST | | | | | | | | | | | | | | | | | |
柯伐合金 Kovar | | | | | E4 | | | | E15 | | | | | |
| | | | | | | | 8 | | | | | | | | | 8 | | | | | | | | | |
鎳-銀 Ni-Ag | E8 | | | E7 | | | | | | | E7 | | | |
8 | | | | | | | | | | | | | | | | | | | | | 8 | | | | | |
鑄鋅 Cast Zn | | | | | E12 | | | | | | | | | |
| | | | | | | | 8 | | | | | | | | | | | | | | | | | | |
(1) 金鍍層應客戶要求而定 。
For electrolyte selection and instrument adjustment lease refer to our customer support.
(2) 見說明書9.8節(Cu/Zn) / See section 8.9 “Copper on Zinc” 。
(3) 見說明書9.9(錫/黃銅) / See section 8.10 “Tin on Brass” 。
(4) 適用于錫/鋅,78%/22% / For Tin/Zinc 78%/22% 。
(5) 這種組合用II型電解池 / Please use the inner measuring cell type II 。
(8) 這種基底鍍層組合需特別仔細,請與本公司聯系。
Requires carefull measurement. Please contact our customer support if necessary .
(ST) 可供鍍層厚度標準 /Coating thickness standards available on stock 。
涂裝 相關儀器:涂層測厚儀,漆膜硬度測試儀,電解膜厚儀,黏度計/粘度計,X射線測厚儀,附著力測試儀,微型光澤儀,分光色差儀,霧影儀,反射率測定儀,光譜儀,涂膜干燥時間記錄儀,標準光源箱